Packaging technologies for critical defence components

Last updated: 18.7.2025
Grant

The 'Packaging technologies for critical defence components' program focuses on advancing System-in-Package technologies to enhance the performance, reliability, and security of electronic components vital for future defence systems. It aims to strengthen the European defence supply chain and foster a collaborative network among EU Member States and Norway, addressing critical needs in high-performance electronics for military applications.

Who is Funded for Defence Technology Packaging

This section details the eligibility criteria for funding, outlining who can apply, the geographical scope of the program, and its core objectives. The program targets a broad range of entities within the defence technology sector across EU Member States and Norway, aiming to bolster European defence capabilities through advanced electronic component packaging.

What is Funded in Defence Component Packaging

This section outlines the types of projects, thematic areas, and activities that are eligible for funding, focusing on critical defence components and their packaging. It also specifies which developmental stages of projects are supported and what costs can be covered.

Type and Scope of Defence Packaging Funding

This section provides information on the nature of the financial support, including the type of instrument and the overall budget for the call. It outlines key financial parameters relevant to the 'Packaging technologies for critical defence components' program.

Conditions and Requirements for Defence Packaging Projects

This section outlines the essential rules, regulations, and specific conditions that applicants and beneficiaries must adhere to for the 'Packaging technologies for critical defence components' program. It covers application terms, collaboration rules, and other critical provisions.

Application Procedure for Defence Packaging Funding

This section guides potential applicants through the process of applying for the 'Packaging technologies for critical defence components' program, from preparation and submission to the evaluation and award channels. It outlines the procedural details and where to find support.

This section details the primary legal and official frameworks that authorize and govern the 'Packaging technologies for critical defence components' funding program, providing insights into its foundational legitimacy and operational regulations.

Similar Programs

#Defence packaging technologies#European Defence Fund#Electronic components#RF sensors#System-in-Package#Defence supply chain#Military systems#Advanced packaging#Radio-frequency applications#Multi-Chip Modules#Secure modules#Anti-tamper solutions#EU defence research#Strategic autonomy#Innovation in defence#SME defence funding#Norway defence collaboration#EDF-2022-RA-MATCOMP-PACOMP

Funding Overview

Funding Status

Funding Status:

Closed

Allocated Budget

Allocated Budget:

The overall call (EDF-2022-RA) to which this topic belongs had an annual budget of 270,000,000 € for 2022. Specific per-project or per-company funding amounts are not detailed.

Deadline

Deadline:

23.11.2022

Award Channel

Award Channel:

Competitive Tender

Region

Region:

EU Member States, Norway

Sectors

Sectors:

Information and Communication Technology, Research and Development, Other

Beneficiaries

Beneficiaries:

Defence industry, electronic components manufacturers, research and development entities in defence, radio-frequency applications, and advanced packaging technologies.

Application Type

Application Type:

Consortium Required

Funding Stages

Funding Stages:

Basic Research, Applied Research, Experimental Development, Feasibility Study, Planning, Product Development

Funding Provider

Program Level:

European Union

Funding Body:

European Defence Fund (EDF)

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