Pilot line on advanced Packaging and Heterogenous Integration

This section outlines who is eligible for funding under the Pilot Line on Advanced Packaging and Heterogeneous Integration program, specifying the target beneficiaries, geographical scope, and the program's strategic objectives. It targets a broad range of entities within the European semiconductor ecosystem, aiming to bolster technological capabilities across the continent.

This section details the types of projects and activities eligible for funding, focusing on cutting-edge developments in advanced packaging and heterogeneous integration. It covers specific technological areas and the maturity levels of the projects supported.

This section provides an overview of the financial support available, including the type of funding instrument, the maximum amount per project for this specific topic, and general information about the program's financial scope.

This section outlines the essential rules, regulations, and specific conditions that applicants and beneficiaries must adhere to. It covers various aspects from application stipulations and collaboration requirements to broader provisions governing the program's implementation.

This section guides applicants through the procedural aspects of the Pilot Line on Advanced Packaging and Heterogeneous Integration program, from application submission to the selection process. It highlights key documents and deadlines.

This section details the foundational legal and official documents that legitimize and govern the Pilot Line on Advanced Packaging and Heterogeneous Integration program, ensuring transparency and adherence to established European frameworks.