Pilot line on advanced Packaging and Heterogenous Integration

This program targets entities involved in semiconductor technology, particularly those capable of developing and deploying advanced pilot lines across the European Union. Its primary goal is to foster innovation in advanced packaging and heterogeneous integration within the semiconductor industry, aligning with the Chips Act to enhance Europe's technological sovereignty and industrial competitiveness.

This funding supports research and innovation actions focused on developing advanced packaging and heterogeneous integration technologies for semiconductors. It covers a broad range of technical developments from wafer-level packaging to novel testing concepts, all designed to advance the state-of-the-art in chiplet-based systems.

This funding program provides significant grant support under the Horizon Europe framework, with a substantial maximum contribution for the establishment of advanced pilot lines in semiconductor technology.

Applications are governed by conditions outlined in the Amended Chips JU Work Programme 2023, emphasizing consortium-based submissions and adherence to fair and non-discriminatory access policies for the pilot line. Important requirements cover application terms, collaboration, and various operational provisions.

The application process for this program involved a single-stage submission, with a past deadline. Evaluation criteria and timelines are comprehensively detailed within the Chips JU Work Programme 2023.

This program is rooted in the European Union's Chips Act and is implemented under the Horizon Europe Framework Programme. Its operations are further shaped by the specific provisions of the Chips JU Work Programme 2023 and broader EU financial regulations.