Pilot line on advanced semiconductor devices based on Wide Bandgap materials
The Pilot Line on Advanced Semiconductor Devices based on Wide Bandgap Materials is a key initiative under the Chips for Europe Initiative. It aims to accelerate the development and deployment of cutting-edge semiconductor technologies and next-generation semiconductors across the European Union. This program fosters innovation by supporting advanced pilot lines, facilitating industrial collaboration, and nurturing new talent within the European semiconductor industry.
Who is Funded
This section details the target beneficiaries, geographic scope, and overarching objectives of the program, focusing on strengthening the European semiconductor ecosystem through collaborative innovation and talent development.
What is Funded
This section outlines the specific types of projects, thematic areas, and activities eligible for funding, focusing on the development of advanced semiconductor devices using Wide Bandgap (WBG) and Ultra-Wide Bandgap (UWBG) materials.
Type and Scope of Funding
This section details the nature of financial support, including the type of financial instrument and the maximum funding available per project.
Conditions and Requirements
This section outlines the essential conditions and requirements for applicants and beneficiaries, covering application stipulations, consortium rules, and other critical provisions relevant to the program.
Application Procedure
This section provides an overview of the application process, including submission details and key support resources for applicants.
Legal Basis
This section outlines the foundational legal documents and regulations that establish and govern the Pilot Line on Advanced Semiconductor Devices based on Wide Bandgap Materials program.
Similar Programs
Funding Overview
Funding Status:
Closed
Maximum Amount:
70,000,000 €
Allocated Budget:
70,000,000 €
Deadline:
29.02.2024
Award Channel:
Framework Programme Call
Region:
European Union
Sectors:
Information and Communication Technology, Research and Development
Beneficiaries:
Semiconductor industry, microelectronics, research and development
Application Type:
Consortium Required
Funding Stages:
Applied Research, Experimental Development, Prototyping, Pilot Testing, Product Development, Process Optimization
Funding Provider
Program Level:
European Union
Funding Body:
European Union
Managed By:
Chips Joint Undertaking (Chips JU)
Additional Partners:
Design Platforms, Competence Centers, other pilot lines
Website: